About Deca Technologies
Tempe, Arizona developer of M-Series fan-out wafer-level packaging with Adaptive Patterning for chiplet and heterogeneous integration. In March 2024 Arizona State University set up a Center for Advanced Wafer-Level Packaging with Deca, backed by the Department of Defense Microelectronics Commons.
Deca Technologies and is based in Tempe, AZ, United States. It is listed under Interconnect & Networking, Custom Silicon.
Compute Technologies
- Custom Silicon
What Deca Technologies works on
Interconnect & Networking
Interconnect is the set of links that move data between chips, between boards and between racks. It includes wires on a package, cables inside a server, and the network switches and optical fibre across a data center. A processor is only as useful as the speed at which it can get data in and out.
Custom Silicon
Custom silicon means a company designs its own chips for its own products or data centers instead of buying standard parts. The chip is made by a foundry such as TSMC, but the design belongs to the customer.
Also in United States
Rambus, Absolics, GlobalFoundries, Arteris, Amkor Technology
