Technology
Interconnect & Networking
Network and fabric silicon, DPUs and SmartNICs, optical I/O, CXL, PCIe and UCIe links, and the chiplet and packaging technology that joins compute together.
93 companies
Explainer
Interconnect & Networking explained
Interconnect is the set of links that move data between chips, between boards and between racks. It includes wires on a package, cables inside a server, and the network switches and optical fibre across a data center. A processor is only as useful as the speed at which it can get data in and out.
Common standards include PCIe, which connects a CPU to devices, NVLink, which connects GPUs to each other, Ethernet and InfiniBand for server networks, and CXL for sharing memory. A newer standard called UCIe defines how chiplets inside one package talk to each other.
How it differs from the usual approach
Compute chips are measured in operations per second. Interconnect is measured in bandwidth (how much data per second) and latency (how long one message takes). In large AI clusters, chips spend a real share of their time waiting for data from other chips, so a faster network can raise the useful output of the whole system without changing the processors.
Where it is used
- Linking GPUs together so that they work as one large accelerator during AI training.
- Connecting thousands of servers in cloud and AI data centers with Ethernet or InfiniBand.
- Joining chiplets inside one processor package.
- Connecting CPUs to memory expanders and storage using CXL and PCIe.
- Optical transceivers that carry traffic between racks and buildings.
What to watch
- Optical links are replacing copper over ever shorter distances. Co-packaged optics puts the optical parts next to the switch chip to cut power use.
- Ethernet is being adapted for AI clusters, The Ultra Ethernet Consortium published its 1.0 specification for that purpose in June 2025.
- Chiplet standards such as UCIe aim to let dies from different makers sit in one package.
- Network speeds in data centers have moved from 100 Gb/s per port toward 800 Gb/s and beyond.
Frequently asked questions
Why does interconnect matter for AI?
Large models are split across many chips, which must constantly exchange results. If the links are slow, the chips sit idle. Faster links raise the share of time spent on useful work.
What is the difference between InfiniBand and Ethernet?
Both move data between servers. InfiniBand was designed for low latency in clusters. Ethernet is the general-purpose network standard, and it is being extended for AI workloads.
What is co-packaged optics?
It places the optical components in the same package as the switch chip instead of in a plug-in module. The goal is lower power use and higher bandwidth per port.
- Liqid Liqid sells composable infrastructure, a way of pooling hardware so servers are assembled in software instead of being fixed at purchase. Its Matrix software controls a PCIe fabric, the high-speed internal bus of a server, and links shared pools of GPUs, NVMe storage, memory and network cards to host machines as needed. This lets an operator reassign expensive GPUs between jobs without moving cards by hand. Company releases carry a Broomfield, Colorado dateline, and a Series C round was announced in 2021. HPC & AI Systems · Interconnect & Networking $100M Series C, 2021
- Scintil Photonics Scintil Photonics, based in Grenoble, France, makes light sources for optical links in AI data centers. Its LEAF Light product is a single chip that combines several lasers, each at a precisely spaced wavelength, so one fibre can carry many data channels in parallel. This approach is called dense wavelength division multiplexing. The company builds it on its own silicon photonics platform, which grew out of research at CEA-Leti, and it works with the foundry Tower Semiconductor on manufacturing. Photonic Computing · Interconnect & Networking $58M Series B (Sept 2025, Yotta Capital/NGP/NVIDIA)

- Astera Labs Astera Labs is a fabless semiconductor company that sells connectivity products for AI and cloud data centers. Its Aries retimers extend PCIe and CXL links between processors, accelerators and memory, and its Scorpio smart fabric switches connect servers and accelerators inside AI racks. These chips are paired with COSMOS software for monitoring and management. Hyperscalers and AI platform providers are among its customers. The company is headquartered in Santa Clara, California, and was founded in 2017. AI Accelerators · Memory & Storage · Interconnect & Networking $10B market cap

- Upscale AI Santa Clara company developing SkyHammer, a switch silicon for scale-up fabrics linking GPUs and XPUs in AI clusters. It announced a $200 million Series A in January 2026 and a $190 million Series A-1 extension in June 2026 with Nvidia among the new investors, bringing total funding to $500 million. It was developed inside Auradine before launching publicly. Interconnect & Networking $500M total incl. $190M Series A-1, Jun 2026

- CACelestial AI Celestial AI developed the Photonic Fabric, an optical interconnect that moves data between chips and memory using light rather than copper wires. The aim is to give AI processors high bandwidth and low latency over longer distances, with less power loss. Marvell Technology announced that it had completed its acquisition of the company in early 2026, and Celestial AI's teams and technology now sit within Marvell's Data Center Group. The company was previously an independent startup based in Santa Clara, California. Photonic Computing · Interconnect & Networking Acquired by Marvell ($3.25B, Dec 2025)
- Xsight Labs Xsight Labs is a fabless chip company that designs programmable network silicon for data centers. Its X2 is a 12.8 Tbps Ethernet switch whose data plane can be reprogrammed after deployment, and its E1 is an 800G data processing unit, a chip that offloads networking work from the main server processor. The company was founded in 2017 and is headquartered in Kiryat Gat, Israel, with other offices in Israel, Armenia and the United States. Some press coverage places it in Tel Aviv instead. ASICs · AI Accelerators · Interconnect & Networking —
- LLLightwave Logic Colorado developer of electro-optic polymer modulators for transceivers and co-packaged optics. In March 2026 it signed a development agreement with Tower Semiconductor to add its modulator designs to Tower's PH18 silicon photonics kit, with tape-outs planned in 2026 for 200G and 400G architectures, and its platform was added to a GlobalFoundries design kit through GDSFactory. It reported a tier-one customer targeting 1.6T transceivers at 200G per lane. Interconnect & Networking · Photonic Computing —
- Rambus Rambus develops memory interface technology, the circuits and protocols that move data between processors and memory. It licenses designs such as memory controllers and PHYs, the physical layer circuits that drive the signal wires, and it also sells memory interface chips for server modules. Its early RDRAM memory was used in the Nintendo 64 console. Rambus was founded in March 1990 by Mike Farmwald and Mark Horowitz and is headquartered in San Jose, California. It also offers security IP that protects chips from tampering. Custom Silicon · ASICs · Memory & Storage —
- Accelink Technologies Wuhan optoelectronic device maker, subsidiary of China Information Communication Technologies, listed in Shenzhen since August 2009. It showed 1.6T transceivers and LPO/LRO modules at OFC 2025 and in December 2025 filed a plan to raise up to RMB 350 million for high-speed optical transmission production and R&D. Interconnect & Networking · Photonic Computing —

- TETeramount Jerusalem developer of TeraVerse, a detachable self-aligning connector that attaches optical fiber to silicon photonics chips in co-packaged optics systems, using its PhotonicPlug and PhotonicBump technology. It raised $50 million in July 2025 in a round led by Koch Disruptive Technologies with AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron. Tower Semiconductor and GlobalFoundries are listed partners. Interconnect & Networking · Photonic Computing $50M, Jul 2025
- Ligentec EPFL spin-out (2016) offering silicon nitride photonic integrated circuit foundry services from Lausanne and France, adding lithium niobate modulators and III-V devices. In January 2026 it expanded a collaboration with X-FAB to offer XPH90 silicon photonics through its platform, and it is part of the EUR 48 million photonixFAB EU pilot line project. Interconnect & Networking · Photonic Computing —

- ATAT&S Austrian maker of high-end IC substrates and PCBs with plants in Leoben, Austria and Kulim, Malaysia. In June 2026 it announced agreements with AMD and another customer to expand Kulim substrate capacity with EUR 1.5 to 2.0 billion of investment, and raised its fiscal 2026/27 growth outlook to 45 to 55%. Interconnect & Networking · Custom Silicon —
- Deca Technologies Tempe, Arizona developer of M-Series fan-out wafer-level packaging with Adaptive Patterning for chiplet and heterogeneous integration. In March 2024 Arizona State University set up a Center for Advanced Wafer-Level Packaging with Deca, backed by the Department of Defense Microelectronics Commons. Interconnect & Networking · Custom Silicon —

- ABAbsolics Covington, Georgia glass-core substrate maker, a subsidiary of SKC (70.05%) with Applied Materials holding the rest, backed by a $75 million CHIPS Act grant. Samples were in package-level reliability evaluation in Taiwan in mid-2026 and SKC announced a KRW 401.1 billion capital increase on 21 August 2026; commercial volume production had not been confirmed. Interconnect & Networking · Custom Silicon KRW 401.1B parent capital increase, Aug 2026
- ENEnfabrica Enfabrica developed networking silicon for AI data centres. Its ACF-S chip combines the functions of a network interface card, a PCIe switch and memory access over CXL, so many GPUs and CPUs can be linked through one device and one pool of bandwidth. In September 2025 Nvidia hired co-founder and chief executive Rochan Sankar and licensed Enfabrica's technology in a cash and stock deal reported at more than $900 million. Reports describe it as a hiring and licensing arrangement rather than a full purchase. AI Accelerators · Interconnect & Networking $115M Series C (Nov 2024, led by Spark Capital)
- Lumentum Lumentum makes optical and photonic chips, components, modules and subsystems for cloud and networking equipment, plus lasers for industrial uses. Its products include optical circuit switches, which route light signals between fibres without converting them to electricity first, and are used in AI data centres. The company was spun off from JDSU, which renamed itself Viavi Solutions, and was founded on 1 August 2015. It is headquartered in San Jose, California. Photonic Computing · Interconnect & Networking —

- KAKandou Kandou makes chip-to-chip links that move data faster over copper. Its Chord signaling sends data across groups of correlated wires, using n plus 1 wires to carry n bits, instead of one pair per signal, which the company says gives more bandwidth for less power than standard SerDes, the circuits that convert data between parallel and serial form. Kandou began as a spin-off from EPFL, the Swiss technical university, founded by Amin Shokrollahi, and is based near Lausanne, Switzerland. ASICs · Interconnect & Networking $225M Series A (March 2026)
- GlobalFoundries GlobalFoundries is a contract chip manufacturer, or foundry, which makes chips designed by other companies rather than selling its own. It focuses on specialty processes such as FD-SOI, embedded MRAM and silicon photonics rather than the smallest leading-edge nodes. It was created in 2009 when AMD divested its manufacturing arm, and it listed on Nasdaq in 2021. The Mubadala Investment Company, a sovereign wealth fund of the United Arab Emirates, owns about 82 percent. Its headquarters is in Malta, New York, beside its main US fab, and it also operates plants in Dresden and Singapore. Custom Silicon · Photonic Computing · Interconnect & Networking —

- Global Unichip (GUC) Taiwanese ASIC design-service company, a TSMC affiliate, that sells die-to-die and memory interface IP. It offers UCIe/GLink-3D 2.0 for 3D stacking and taped out HBM4 PHY IP on TSMC N3P in April 2025, demonstrating a 12 Gbps HBM4 platform on 3nm with CoWoS in April 2026. Interconnect & Networking · Custom Silicon · ASICs —

- CNCornelis Networks Cornelis Networks builds high-speed interconnects, the network fabric that links servers in supercomputers and AI clusters so they can share data with low delay. Its product line is Omni-Path, which began at Intel, and the company was spun out of Intel in September 2020. The founders are Philip Murphy, Vladimir Tamarkin and Gunnar Gunnarsson, who worked together at SilverStorm Technologies. Cornelis is based in Pennsylvania and sells Omni-Path as an alternative to InfiniBand and Ethernet fabrics. ASICs · AI Accelerators · Interconnect & Networking $131M+
- ATASE Technology Holding ASE Technology Holding is the parent group of Advanced Semiconductor Engineering, an outsourced semiconductor assembly and test (OSAT) provider. An OSAT takes finished wafers from chip designers and foundries, then packages and tests them. ASE offers flip chip, fan-out wafer-level, 2.5D and 3D packaging and system-in-package, and Gartner has ranked it the largest OSAT. Brothers Jason and Richard Chang founded it in 1984 in Kaohsiung, where it is still headquartered. The group also includes Siliconware Precision Industries, which it agreed to join in a 2016 holding company deal. Custom Silicon · Interconnect & Networking —
- JCET Group JCET Group is a Chinese outsourced semiconductor assembly and test (OSAT) company, which packages and tests chips on behalf of chip designers and foundries. It serves markets such as mobile, automotive and computing and offers advanced packaging alongside conventional formats. The record lists its headquarters as Wuxi and its founding as 1972, but this entry could not verify either figure, the ranking as third largest, or details of its ownership and acquisitions from sources checked, so those are left out. Custom Silicon · Interconnect & Networking —
- Retym Retym designs digital signal processors for coherent optics, the laser links that carry data between data centers. Its chips are programmable and aimed at cloud and AI infrastructure, and the company positions itself as a neutral supplier to an open coherent optics ecosystem. It emerged from stealth on 31 March 2025 and says it has raised over $180 million. Retym is headquartered in Cupertino, California, with offices in Austin, Tel Aviv and Yerevan. DSPs · AI Accelerators · Interconnect & Networking $75M Series D / $180M total (March 2025, Spark Capital-led)

- iPronics iPronics, based in Valencia, makes programmable photonic chips. A photonic chip routes light through tiny waveguides, and iPronics arranges these in a mesh of tunable switches, much as an FPGA arranges reconfigurable logic, so one chip can be set up for different optical functions through software. Its SmartLight Processor began shipping to customers in 2023. The company was founded in 2019 as a spinoff of the Universitat Politecnica de Valencia, and it now also targets optical switching inside AI data centers. Photonic Computing · Interconnect & Networking €20M Series A (Jan 2025, led by Triatomic Capital)

- MACOM Technology MACOM designs and manufactures semiconductors for data center, telecommunications, and industrial and defense uses. Its range covers high-speed optical, RF, microwave and millimeter wave products, including components for optical links in data centers and amplifiers for radar and satellite systems. The business traces its roots to Microwave Associates, founded in 1950. The current company was incorporated in Delaware in 2009, completed its IPO in 2012, is headquartered in Lowell, Massachusetts, and trades on Nasdaq under MTSI. ASICs · Analog Computing · Interconnect & Networking —
- Montage Technology Montage Technology is a Shanghai-based fabless chip company that supplies memory interface chips for servers. Its products include DDR5 registering clock drivers, data buffers and related module parts such as SPD hubs, temperature sensors and power management ICs. These parts let server memory modules run at higher data rates and capacities, which matters for AI and data center systems. It released its fourth-generation DDR5 RCD, rated to 7200 MT/s, in January 2024. ASICs · Memory & Storage · Interconnect & Networking —

- ASAlphawave Semi Alphawave Semi designs high-speed connectivity technology for data centres and AI systems, including the serializer-deserializer (SerDes) circuits that move data between chips and over cables, and chiplets, which are small chip pieces combined in one package. It supplies these as licensed designs and as finished silicon. The company is headquartered in London and was founded in 2017. Qualcomm announced an agreement to acquire it in June 2025, and completion of that deal was not independently confirmed. ASICs · Interconnect & Networking —
- Celestica Celestica is a Toronto-based technology company that designs, engineers and manufactures infrastructure for AI and cloud computing, with a focus on data center hardware. Besides building products for customers, it sells its own Platform Solutions in storage, compute, networking and software. It also serves communications, aerospace and defense, healthcare technology, industrial and energy markets. Its company site names Atrenne and PCI as subsidiaries. HPC & AI Systems · Interconnect & Networking —
- Zhongji Innolight Chinese maker of high-speed optical transceivers for AI data centers, with 800G and 1.6T silicon-photonics modules in volume shipment. A brokerage note put 2025 revenue near RMB 38 billion, and the company reported H1 2026 revenue of about RMB 41.8 billion. It added a Hong Kong listing on 30 July 2026 alongside its Shenzhen listing. Interconnect & Networking · Photonic Computing —
- Fujikura Japanese cable and optical fiber maker supplying MPO/MMC multi-fibre connectors, ferrules and fiber cable for AI data centers. In March 2026 it decided to invest up to JPY 300 billion in Japan and the US to as much as triple optical fiber cable capacity; its information and communications segment grew 44.7% in the year to March 2026. Interconnect & Networking · Photonic Computing —
- PTPowertech Technology Powertech Technology, often called PTI, is a Taiwanese outsourced semiconductor assembly and test (OSAT) company, meaning it packages and tests chips for other firms. It focuses on memory, offering chip probing and final test for DRAM, NOR and NAND flash, along with wafer-level packaging, flip chip, wire-bond BGA and system-in-package. It also lists panel-level fan-out, which packages chips on large rectangular panels instead of round wafers. Its group includes Greatek Electronics and Tera Probe. It trades on the Taiwan Stock Exchange under 6239. Custom Silicon · Interconnect & Networking —
- Arteris Campbell, California licensor of network-on-chip interconnect IP (FlexNoC, FlexGen) and chiplet interconnect for SoCs and multi-die AI devices, founded in Paris. Full-year 2025 revenue was $70.6 million and the 2026 forecast was raised to $95 to $98 million in August 2026. It closed the $45 million Cycuity acquisition in January 2026; Renesas and SiEngine are named FlexNoC customers. Interconnect & Networking · Custom Silicon —
- ETEthernovia Ethernovia makes networking chips for vehicles, including single-pair Ethernet PHYs, which are the transceivers that put Ethernet on thin automotive cabling, and deterministic packet processors that move data in a guaranteed time. Cars are shifting from many small controllers to a few central computers, and this approach replaces older in-vehicle buses with Ethernet. The company also offers an Ethernet sensor bridge for NVIDIA Holoscan aimed at physical AI systems. Ethernovia was founded in 2018 by Ramin Shirani, formerly of Aquantia, and is based in San Jose, California. Qualcomm Ventures and Porsche SE led its 2023 Series A. ASICs · Interconnect & Networking $90M+ Series B (Jan 2026)
- Applied Optoelectronics Sugar Land, Texas maker of lasers and optical transceivers for data centers. It announced a $53 million 800G order from an unnamed hyperscale customer on 23 March 2026 and a further $71 million order on 2 April 2026, and said in its Q2 2026 results that demand exceeds capacity through mid-2027. Interconnect & Networking · Photonic Computing —
- RARanovus Ranovus designs optical engines that move data between chips in data centers using light. Its Odin engines combine a quantum dot laser, ring-shaped modulators that encode data onto the light, and photodetectors on a silicon photonics chip. The engines are aimed at pluggable optical transceivers and at co-packaged optics, where the optics sit beside the switch or processor chip to reduce power use. Ranovus was founded in 2012, works from Ottawa, and has named IBM, TE Connectivity and SENKO as packaging partners. Photonic Computing · Interconnect & Networking $100M+ Invest Ontario-backed expansion (Aug 2025)
- Enosemi Enosemi was a Silicon Valley start-up that designed photonic integrated circuits, which are chips that move data as light instead of electrical current. Its work supports co-packaged optics, a design that places optical links beside the processor package to shorten electrical paths and reduce power. AMD announced that it had acquired Enosemi in May 2025 and had worked with it before as a development partner. The price was not disclosed. Founders Ari Novack and Matthew Streshinsky joined AMD to support photonics work in future AI systems. The record should be treated as an acquired company rather than an independent one. Photonic Computing · Interconnect & Networking Acquired by AMD
- Avicena Avicena develops optical interconnects that link chips using microLEDs, tiny light-emitting diodes, in place of the lasers used in most optical links. Its LightBundle technology sends data in parallel over multicore fibre, with silicon photodetectors and custom transceiver chips at each end. The company says it supports links beyond 10 metres at low energy per bit, a claim not independently measured. Avicena is based in Sunnyvale, California, and in March 2026 it launched an evaluation kit for LightBundle. Photonic Computing · Interconnect & Networking $65M Series B (May 2025, Tiger Global led)

- Amkor Technology Amkor is an outsourced semiconductor assembly and test (OSAT) company, meaning chip designers and foundries hire it to package and test finished chips. Its services include wire bonding, flip chip with copper pillar bumps, and packaging for image sensors and RF devices. It was founded in 1968 by Hyang-Soo Kim, and its name blends America and Korea. It is headquartered in Tempe, Arizona and listed on Nasdaq. In 2023 it announced a US$2 billion advanced packaging plant in Arizona, which later moved to a site in Peoria. Custom Silicon · Interconnect & Networking —
- Parade Technologies Fabless chip company listed on the Taipei Exchange since 2011 that makes PCIe and CXL retimers, including the 16-lane PCIe 5.0/CXL PS8936 announced in January 2023, plus DisplayPort and other high-speed signal-conditioning chips. Earlier retimers include the PS8925 and PS8926 for PCIe Gen 4. Interconnect & Networking —
- CryoCoax Cryogenic RF interconnect brand of Intelliconnect (Europe) Ltd, incorporated in 2005 and based at the Corby Innovation Hub, Corby. Products include superconducting and flexible cryogenic cable assemblies, attenuators and the Q-CON high-density connector (SMPM interface, 4.75 mm pitch, up to 24 ways) for dilution refrigerators. Q-CON was tested at the UK National Physical Laboratory, with coverage in December 2023 describing its use in NPL's Advanced Quantum Metrology facility, and CryoCoax has had a sales and technology partnership with Delft Circuits since June 2020. No dated 2024 to 2026 events were found. Quantum Computing · Interconnect & Networking —

- NHanced Semiconductors Advanced packaging foundry headquartered in Batavia, Illinois with facilities in North Carolina and Indiana, offering die-to-wafer hybrid bonding, 3D integration and interposers. It took delivery of a Besi Datacon 8800 CHAMEOultra plus hybrid bonder and licenses the DBI process from Adeia; it announced expanded hybrid bonding capability in January 2026. Interconnect & Networking · Custom Silicon —

- Ibiden Japanese maker of IC package substrates for AI servers. Digitimes and Japanese filings reported a plan in February 2026 to invest about JPY 500 billion in IC substrates over fiscal 2026 to 2028, starting with the Gama plant, with the Ono plant in a second phase; fiscal 2025 revenue was JPY 416.2 billion. Interconnect & Networking · Custom Silicon —
- Eliyan Eliyan makes interconnect technology that links chiplets, the small dies packaged together to form one large processor. Its NuLink products are IP cores, meaning licensable circuit designs, for die-to-die and chip-to-chip connections in AI and high-performance computing systems. It also offers NuLight, optical chiplets that use micro VCSEL lasers to carry data beyond the reach of copper. Ramin Farjadrad is chief executive and a co-founder, alongside Syrus Ziai and Patrick Soheili. ASICs · Interconnect & Networking $50M strategic investment (January 2026); total >$100M

- Silicom Silicom designs and sells server network adapters and connectivity products, including FPGA-based SmartNICs, for equipment makers, cloud providers and telecom operators. Its cards are built into customer systems such as security, WAN optimization and network appliances, usually through a design win model. The company was founded in 1987, is based in Kfar Sava, Israel, and is part of the RAD Group. Its shares are listed on Nasdaq under SILC and on the Tel Aviv Stock Exchange. FPGAs · Edge Computing · Interconnect & Networking —

- Salience Labs Salience Labs builds all-optical switches for AI data centers, using silicon photonics so that traffic is steered as light without being converted to electrical signals and back. Conventional switches convert at every hop, which adds delay and power use. Its OC-32M module is a named product, and it has demonstrated a 64-port optical circuit switch. The company is led by founder and CEO Vaysh Kewada, with Johannes Feldmann as co-founder and CTO, and its press releases are datelined Oxford, England. Its performance figures for latency, power and cost are company claims. Photonic Computing · AI Accelerators · Interconnect & Networking $30M Series A (Feb 2025, led by ICM HPQC Fund and Applied Ventures)

- Unimicron Taiwanese maker of ABF IC substrates and printed circuit boards for AI processors. It said AI would be about 60% of ABF substrate revenue in 2026, up from about 40%, and reports put 2026 capital spending at NT$25 to 34 billion, including the Guangfu plant in Hsinchu in mass production since late 2024. Interconnect & Networking · Custom Silicon —

- SMART Photonics Eindhoven indium phosphide photonic chip foundry used for transceivers and photonic integrated circuits. In July 2023 it raised EUR 100 million from investors including ASML, NXP and VDL Groep, with EUR 60 million of public funding via PhotonDelta, to expand capacity. Interconnect & Networking · Photonic Computing EUR 100M, Jul 2023
- ATAccton Technology Hsinchu-based maker of white-box network switches. Its AI fabric designs pair a 6RU dual-Ramon3 128x800G fabric switch with a Jericho3-AI leaf switch for clusters up to 32K GPUs, contributed to the Open Compute Project, and it reported 2025 revenue of NT$248.3 billion. Interconnect & Networking · AI Accelerators —
- Coherent Coherent makes optical materials, lasers and semiconductor components, including VCSELs (vertical-cavity surface-emitting lasers, used in 3D sensing), silicon carbide substrates and optical transceivers that move data over fibre. It began as II-VI Incorporated, founded in 1971 by Carl Johnson and James Hawkey, and made lenses and mirrors for CO2 lasers. In 2022 II-VI acquired the laser maker Coherent, Inc. and took its name. Its headquarters are in Saxonburg, Pennsylvania, north of Pittsburgh. Photonic Computing · Custom Silicon · Interconnect & Networking —

- TSMC TSMC is a pure-play semiconductor foundry, meaning it manufactures chips for other companies and does not sell chips under its own brand. Its customers include designers of CPUs, GPUs, smartphone processors and AI accelerators, and it also offers advanced packaging services under the 3DFabric name. In 2025 it reported making over 12,000 products for 534 customers. It sits between chip designers and system makers in the supply chain. TSMC was founded in 1987 by Morris Chang and is headquartered in Hsinchu, Taiwan. Custom Silicon · Interconnect & Networking —

- MTMixx Technologies San Jose startup building silicon-photonics optical interconnects for data movement between GPUs, with an Advanced 3DS Platform for AI training and inference. Founded in 2023 by Vivek Raghuraman and Rebecca Schaevitz, it raised a $33 million Series A in December 2025 led by ICM HPQC Fund with TDK Ventures and others, and plans R&D centers in the US, India and Taiwan. Interconnect & Networking · Photonic Computing $33M Series A, Dec 2025
- SCSuzhou Centec Communications Suzhou designer of Ethernet switch ASICs and white-box switches for data center, enterprise and carrier networks, formerly Centec Networks, renamed in June 2021 and listed on the Shanghai STAR market as 688702. It raised $47 million in 2016 led by China's IC industry fund. Its documented products reach 100GE; AI-specific products were not confirmed. Interconnect & Networking —
- POET Technologies POET Technologies develops photonic integration using its Optical Interposer platform, which places optical and electronic components together at wafer level. Its Blazar light source is intended to power co-packaged optics and chip-to-chip optical links in AI and cloud data centers. The company also works on optical engines for high-speed transceivers. POET is based in Toronto, Ontario, and is listed on the TSX Venture Exchange and on Nasdaq under the ticker POET. Photonic Computing · Custom Silicon · Interconnect & Networking —
- Intel Foundry Intel Foundry is the contract manufacturing arm of Intel, which makes chips for outside customers as well as for Intel's own products. It offers its own process technologies and advanced packaging, which joins several chips into one package in 2D, 2.5D or 3D layouts, plus test services and a multi-product shuttle program for prototyping. Intel's older foundry effort was reported closed in 2018, and the current business is a later relaunch. The parent company is headquartered in Santa Clara, California, and the US federal government is its largest listed shareholder at 9.9 percent. Custom Silicon · Interconnect & Networking —
- Chipletz Chipletz makes the Smart Substrate, a package base that lets chips from different suppliers be combined in one package. A substrate is the layer a chip package is built on, and the company says its design removes the need for an interposer, the silicon layer normally used to wire separate dies together. It targets AI and high-performance computing systems, where large processors are increasingly assembled from several smaller chiplets. Chipletz lists its address in Bee Cave, Texas, in the Austin area. ASICs · Interconnect & Networking Series B (SKC Ltd)

- EXTOLL EXTOLL develops semiconductor interconnect intellectual property, meaning pre-designed circuit blocks that other chip makers license. Its products include SerDes (high-speed serial links between chips), UCIe chiplet interfaces for connecting small dies inside one package, and a network-on-chip design. It says its digital-centric architecture targets mainstream 12 to 28 nm manufacturing processes with low power use. EXTOLL GmbH is headquartered in Mannheim, Germany. A founding year could not be confirmed from the sources checked. Interconnect & Networking · Custom Silicon —

- Hyperlight HyperLight makes optical modulators from thin-film lithium niobate, a crystal whose refractive index shifts quickly under an electric field. A modulator is the part that encodes data onto a light beam in fibre links and data centre networks. The material allows high speed at low drive voltage compared with silicon or indium phosphide designs. The company sells packaged modulators and a chiplet platform, and it announced a 110 GHz IQ modulator aimed at signalling above 240 GBaud. HyperLight is based in Cambridge, Massachusetts and was spun out of Marko Loncar's lab at Harvard. Photonic Computing · Interconnect & Networking $37M Series B (2025, led by Summit Partners)

- Fabrinet Contract manufacturer of optical communications modules and components with operations in Thailand and expansion in California. Fiscal 2026 (year to June) revenue was $4.6 billion, up 36%, with Cisco 20%, Nvidia 16%, Nokia 11% and Amazon 11% of sales. A tenth Chonburi building is due by early 2027. Interconnect & Networking · Photonic Computing —

- Eoptolink Chengdu-based optical transceiver maker listed on the Shenzhen exchange in 2016. At OFC 2025 it showed an 800G module for multicore fiber, a second-generation 1.6T OSFP family using a 3nm DSP, a 1.6T multimode module on 200G VCSELs and a 1.6T linear receive optics module. Interconnect & Networking · Photonic Computing —

- Tower Semiconductor Tower Semiconductor is a specialty foundry that manufactures analog, RF, power and silicon photonics chips for other companies. Its silicon germanium and silicon photonics platforms serve optical transceivers and networking gear used in AI data centers. It is a supplier of process technology rather than a designer of its own processors. The company is headquartered in Migdal Haemek, Israel, and has announced a government-backed expansion of 300mm silicon photonics and silicon germanium capacity in Japan. ASICs · Custom Silicon · Interconnect & Networking —

- Point2 Technology San Jose fabless company building e-Tube, an RF interconnect that sends data over plastic waveguides as an alternative to copper and optical links in AI racks. Products are Active RF Cables, near-packaged and co-packaged e-Tube. It signed an MOU with Foxconn Interconnect Technology in August 2025 and raised a Series B extension in 2026 led by Maverick Silicon, with NVentures and UMC Capital; later reports put the Series B at $136 million with Arm and LB Investment. Interconnect & Networking Series B total reported $76M (Apr 2026), later $136M; sources differ

- Nubis (Ciena) Nubis develops optical interconnect technology, which uses light rather than copper wires to move data between chips inside AI data centres. Moving data at high speed and low power is a growing limit on how large AI clusters can be built, and optical engines placed close to the processor aim to ease it. Nubis was acquired by Ciena, a maker of optical networking equipment, in 2025. The headquarters and founding year in this record could not be confirmed. Photonic Computing · Interconnect & Networking —
- NVIDIA NVIDIA designs GPUs, CPUs, DPUs and networking products such as NVLink, InfiniBand and Ethernet, and develops the CUDA software platform that runs on its GPUs. Its Data Center products are widely used for AI training and inference, and it also sells GeForce graphics cards for gaming and RTX workstation GPUs. NVIDIA is fabless. Foundries such as TSMC make its wafers, memory comes from suppliers including SK hynix, Micron and Samsung, and partners handle assembly and packaging. The company was incorporated in 1993 and is based in Santa Clara, California. GPUs · AI Accelerators · HPC & AI Systems —
- Napatech Napatech makes SmartNICs and data processing units, which are network cards with their own programmable chips so that packet capture, filtering and monitoring happen on the card instead of the server processor. Its products are built on FPGAs, chips that can be reconfigured after manufacture. The company is headquartered in Søborg, north of Copenhagen, Denmark, and its shares trade on the Oslo Stock Exchange under the ticker NAPA. Napatech states a founding year of 2001 on its own site, while other sources give 2003. FPGAs · Edge Computing · Interconnect & Networking —
- Oriole Networks Oriole Networks makes optical networking equipment for AI data centres. Its PRISM system replaces layers of electrical packet switches with optical circuit switches that redirect beams of light and can reconfigure in about 100 nanoseconds, which the company says lowers the power and delay of linking many GPUs. The technology comes from research by Professor George Zervas at University College London, and the company licenses it through UCL's technology transfer arm, UCLB. Oriole was founded in 2023, is based in London and is led by chief executive James Regan. Photonic Computing · Interconnect & Networking $35M total (Seed + $22M Series A 2024, Plural-led)

- PRPrimemas Santa Clara chiplet company with an R&D center in Seoul that sells Hublets, pre-built hub SoC chiplets with die-to-die links, including Falcon-1 with CXL 3.2 support. It raised a $72 million Series B reported in January 2026 and signed Asicland in 2025 to support chiplet development. Interconnect & Networking · Custom Silicon $72M Series B, Jan 2026
- Lightmatter Lightmatter develops photonic interconnect technology for AI data centers, using light rather than electrical signals to move data between chips. Its Passage product line includes the M1000, a photonic interposer, and the L200 and L200X, co-packaged optics engines. The M1000 is built on the GlobalFoundries Fotonix silicon photonics platform, and the L200 was developed with Alphawave Semi. Lightmatter is a privately held company whose products target the bandwidth limits that arise when connecting large numbers of GPUs and other accelerators. Photonic Computing · Interconnect & Networking $400M Series D at $4.4B valuation (Oct 2024)

- Tianshui Huatian Technology Tianshui Huatian Technology is a Chinese outsourced semiconductor assembly and test (OSAT) company that packages and tests chips for other firms. It describes itself as among the largest in mainland China and focuses on advanced packaging such as system-in-package, through-silicon via (TSV), fan-out and wafer-level packaging. It was formed in 2003 from the Yonghong Appliance Factory, a state-owned plant set up in 1969 to make integrated circuits. It is headquartered in Tianshui, Gansu, and listed on the Shenzhen Stock Exchange since 2007. Its subsidiaries include Unisem and Flipchip. Custom Silicon · Interconnect & Networking —

- Credo Semiconductor Credo designs high-speed connectivity products for data centers, including SerDes technology, retimers, optical DSPs and active electrical cables sold under the HiWire name. These parts move data between servers, switches and accelerators in AI and cloud networks. The company is fabless, selling mainly to hyperscalers, equipment makers and optical module makers. It was founded in 2008, is headquartered in San Jose, California, and trades on Nasdaq under CRDO after listing in 2022. ASICs · Photonic Computing · Interconnect & Networking —
- Lumilens Silicon photonics company founded in early 2024 by Ankur Singla (earlier founder of Volterra and Contrail). Its LumiCore platform underlies near-package and co-packaged optics for GPU scale-up links and 800G and 1.6T pluggable transceivers. On 6 August 2026 it left stealth with a Series C of more than US$700 million at a US$5.51 billion valuation, bringing total funding above US$900 million, and said its first product ships to a hyperscaler. Interconnect & Networking · Photonic Computing More than US$900M total; US$700M+ Series C, Aug 2026
- Arista Networks Santa Clara maker of Ethernet switches for cloud and AI back-end networks, including the Etherlink line and the 7800R4 platform. It reported Q1 2026 revenue of $2.709 billion, raised its 2026 outlook to about $11.25 billion and its AI networking target to $3.25 billion. Interconnect & Networking · AI Accelerators —

- NcodiN NcodiN is a Paris company building optical interposers for AI hardware. An interposer is the layer that links chips inside a package, and NcodiN wants to carry data between them as light rather than over copper wires. Its approach uses very small lasers built into the interposer, intended for manufacture on standard 300 mm silicon wafers. The company was founded in 2023 and announced a 16 million euro seed round in November 2025, led by MIG Capital. Photonic Computing · Interconnect & Networking €16M seed (Nov 2025)
- Effect Photonics EFFECT Photonics designs optical components for fiber networks, centered on coherent pluggable transceivers. Coherent optics encode data in both the amplitude and phase of light, which lets signals travel long distances at high speed. The company builds its lasers and optical circuits on indium phosphide, a semiconductor suited to generating and handling light, and integrates many functions on a single photonic integrated circuit. It was founded in 2010 as a spin-off from Eindhoven University of Technology and is headquartered in Eindhoven, the Netherlands. Photonic Computing · Interconnect & Networking $24M Series D extension (June 2025, total $62M)
- Black Semiconductor Black Semiconductor develops chips that use graphene, a one-atom-thick form of carbon, to build optical links on top of conventional silicon electronics. The goal is to move data between chips as light instead of electrical signals, which can reduce energy use and heat. The company was founded in 2020 in Aachen, Germany, as a spin-off from the AMO research center, by brothers Daniel and Sebastian Schall. Its FabONE site in Aachen houses a 300 mm wafer pilot line. Custom Silicon · Interconnect & Networking €211M public support (cumulative); acquired Applied Nanolayers March 2025
- Nexthop AI Santa Clara maker of custom Ethernet switching systems for hyperscale AI data centers, founded by former Arista executive Anshul Sadana. It launched in March 2025 with $110 million led by Lightspeed and raised a $500 million Series B in March 2026 at a reported $4.2 billion valuation. A March 2026 product launch covered scale-out, scale-across and front-end switches using Broadcom silicon. Interconnect & Networking · AI Accelerators $500M Series B, Mar 2026
- Semtech Semtech is an American maker of analog and mixed-signal semiconductors, chips that handle real-world signals such as radio, power and touch. It developed LoRa, a low-power, long-range wireless networking technology for Internet of Things devices, and also sells proximity sensors, wireless charging chips and power management products. In January 2023 it completed its purchase of Sierra Wireless, a Canadian maker of cellular IoT modules, for about US$1.2 billion including debt. Semtech was founded in 1960 and is based in Camarillo, California. Custom Silicon · Edge Computing · Interconnect & Networking —
- XTXConn Technologies XConn Technologies is recorded as a developer of switch chips for CXL and PCIe, the interconnects that link processors, memory and accelerators inside servers. CXL lets servers share and expand pools of memory. Neither the company's website nor a Marvell announcement could be reached during checking, so the headquarters in San Jose, the 2020 founding year and the reported Marvell acquisition could not be verified. The previous description gave a deal value and closing date that remain unconfirmed and have been left out. ASICs · In-Memory Computing · Interconnect & Networking —
- BSBaya Systems Baya Systems sells network-on-chip fabric IP, which is the on-chip wiring and switching that moves data between processing cores, memory and other blocks inside a processor or across chiplets. Chiplets are small dies combined in one package. Its WeaveIP products include coherent and non-coherent fabrics and NeuraScale, and its WeaverPro software is used to model and tune system designs. Its website lists a Santa Clara, California headquarters, with offices in Austin, Cambridge and Bengaluru. Custom Silicon · ASICs · Interconnect & Networking $36M+ Series B (Jan 2025)
- LULumiphase Lumiphase develops silicon photonics chips that add barium titanate, or BTO, a material that changes its optical properties strongly under an electric field. This is used to build optical modulators, the components that encode electronic data onto light, with the aim of faster and more efficient optical links for transceivers and GPU interconnects. The company is based in the Zurich area, with its address in Stäfa, Switzerland. The company describes its products as modulators, pluggable transceivers and GPU interconnects. Photonic Computing · Interconnect & Networking Nvidia strategic investment (Sept 2025); $5.4M total
- Broadcom Broadcom is a semiconductor and infrastructure software company. Its chip lines include custom AI accelerators it calls XPUs, Ethernet switching and routing silicon, and Ethernet network adapters, which are used in AI and cloud data centers. It also owns infrastructure software, notably VMware Cloud Foundation for private cloud. Broadcom is mostly fabless and names TSMC as a key manufacturing partner. It works with large cloud customers on custom chips and sells networking silicon to system builders. It is headquartered in Palo Alto, California. ASICs · AI Accelerators · Photonic Computing —
- MEMemVerge MemVerge develops software for managing memory, with a history in CXL memory pooling and tiering. CXL is a standard that lets servers share and expand memory over a fast interconnect. Its Memory Machine products were built for that purpose. Its current site also lists MemMachine, an open source memory layer that lets AI agents store and recall information across sessions. Charles Fan is listed as co-founder and chief executive. In-Memory Computing · Memory & Storage · Interconnect & Networking —
- Enlightra Enlightra develops chip-scale lasers that emit many wavelengths of light from a single source. Each wavelength can carry its own stream of data, so one laser can stand in for dozens of separate ones in optical links between GPUs and other chips. The lasers use silicon photonics manufacturing, and the aim is to replace copper wiring in AI clusters with lower power use and a smaller footprint. The company has built 8 and 16 channel devices and plans pilot production in 2027. Enlightra was founded in 2022 by John Jost and Maxim Karpov and is based in Lausanne, Switzerland. Photonic Computing · Interconnect & Networking $15M seed (Dec 2025)
- MetisX (XCENA) MetisX, now trading as XCENA, develops memory-centric computing based on CXL, a standard that lets processors share and expand memory over a fast link. The aim is to place some processing close to the memory so that less data must move across the system. Its first product is called MX1. The company is based in Seongnam, South Korea, and was founded in 2022. In-Memory Computing · Memory & Storage · Interconnect & Networking $44M Series A (2024); $100M Series B pending (Jan 2026)

- Panmnesia Panmnesia designs technology for CXL, an open standard that lets processors, accelerators and memory devices share memory over a fast link. Its products include CXL switches and controllers that let many chips draw on a shared pool of memory, which helps AI systems whose memory needs outgrow what one GPU can hold. The company was founded in 2022 as a spin-off from KAIST, the Korean research university in Daejeon, where it is based. It is led by KAIST professor Myoungsoo Jung. In-Memory Computing · Memory & Storage · Interconnect & Networking $30M project funding (May 2025); $102M total
- Quintessent Santa Barbara spin-out from John Bowers' UCSB photonics group developing a gallium arsenide O-band quantum dot comb laser that emits eight wavelengths for AI data center optical links. It closed a seed round in March 2024 and a $40 million Series A on 24 August 2026 led by Cycle Capital with Ciena among new investors, and has begun customer sampling. Interconnect & Networking · Photonic Computing $40M Series A, Aug 2026

- Xscape Photonics Xscape Photonics develops lasers for the optical links that connect AI computing hardware in data centers. Most links use one laser per wavelength, or colour, of light. Xscape builds a single silicon photonics chip that produces many wavelengths at once, which lets one fibre carry more data. In March 2026 it launched FalconX, a pluggable laser module emitting up to eight wavelengths, and it also described a programmable multi-wavelength platform called ChromX. The company was founded in 2022 and is based in Fort Lee, New Jersey. Photonic Computing · Interconnect & Networking $37M Series A extension (March 2026, $81M total Series A)

- SBSilicon Box Silicon Box is a Singapore company that runs a foundry for chiplet integration, which means joining several small chips into one package instead of making one large chip. Its approach works with very fine wiring dimensions, below 5 microns, to connect the chiplets closely. It operates a factory at 20 Tampines Industrial Avenue 3 in Singapore and has announced a development agreement for a site in Novara, Italy. Listed investors include UMC Capital, Intel Capital, Tata Electronics, TDK Ventures and EDBI. ASICs · Interconnect & Networking $200M+
- UnifabriX Haifa company building CXL-based memory pooling and sharing systems, including the Smart Memory Node (32 TB of DDR5 in a 2RU chassis) first shown at SC22 over a CXL 3.0 fabric. It reported an $11 million seed round in January 2025 and was planning a further round in the second half of 2025. Founders are Ronen Hyatt and Danny Volkind. Interconnect & Networking · In-Memory Computing $11M seed, Jan 2025

- Lightelligence Lightelligence develops photonic products for AI systems, with two segments, optical interconnect and optical computing. Optical interconnect, which links chips using light, produces its current revenue, while optical computing, which does calculations with light, is a longer-term effort. Yichen Shen, who holds a physics PhD from MIT, founded the company in 2017. It listed on the Hong Kong stock exchange on 28 April 2026 under the code 1879, and filings name Shanghai Xizhi Technology as the operating company. Photonic Computing · Interconnect & Networking $210M+ Series C (2025); HKEX IPO April 2026 raised ~$322M

- Cisco Networking company whose Silicon One line supplies switch and router silicon. On 10 February 2026 it announced Silicon One G300, a 102.4 Tbps Ethernet switch chip with 200G SerDes for AI clusters, and new N9000 and 8000 series systems built on it, in liquid-cooled and air-cooled versions. Interconnect & Networking · Custom Silicon · AI Accelerators —

- ALAyar Labs Ayar Labs makes optical input and output for chips. Its TeraPHY chiplet is a small silicon photonics die that sits in the same package as a processor and sends data as light, and its SuperNova is a separate multi-wavelength laser source that feeds light to those chiplets over standard single-mode fibre. This replaces electrical links, which lose energy and range at high speeds. The company was founded in 2015 and describes its chiplets as compatible with the UCIe chiplet standard. Directories place its headquarters in San Jose, California. Photonic Computing · Interconnect & Networking $500M Series E (Mar 2026, led by Neuberger Berman; NVIDIA, AMD strategic)
- OpenLight OpenLight, based in Santa Barbara, California, offers a silicon photonics platform with lasers built into the chip. Silicon cannot easily emit light, so most designs attach separate laser parts. OpenLight instead bonds indium phosphide material onto silicon wafers, allowing lasers, modulators, amplifiers and detectors on one chip. Customers design with its process design kit, and it is validated at the foundry Tower Semiconductor. The technology traces to Aurrion, a UC Santa Barbara spinout that Juniper Networks bought in 2016. OpenLight targets 800G and 1.6T links for AI data centers. Photonic Computing · Interconnect & Networking $50M Series A-1 extension (Apr 2026, total $84M)
- Marvell Technology Marvell Technology designs semiconductors for data infrastructure, including custom silicon for cloud operators, electro-optics such as coherent DSPs, laser drivers and silicon photonics, and networking and storage chips. Its custom ASIC work lets data center customers build accelerators tailored to their own workloads. The company completed its acquisition of Celestial AI in February 2026, adding the Photonic Fabric optical interconnect for scale-up AI systems. Marvell is headquartered in Santa Clara, California. Photonic Computing · AI Accelerators · Interconnect & Networking $3.25B Celestial acquisition