About Tianshui Huatian Technology
Tianshui Huatian Technology is a Chinese outsourced semiconductor assembly and test (OSAT) company that packages and tests chips for other firms. It describes itself as among the largest in mainland China and focuses on advanced packaging such as system-in-package, through-silicon via (TSV), fan-out and wafer-level packaging. It was formed in 2003 from the Yonghong Appliance Factory, a state-owned plant set up in 1969 to make integrated circuits. It is headquartered in Tianshui, Gansu, and listed on the Shenzhen Stock Exchange since 2007. Its subsidiaries include Unisem and Flipchip.
Tianshui Huatian Technology was founded in 2003 and is based in Tianshui, China. It is listed under Custom Silicon, Interconnect & Networking. Its shares trade as 002185.SZ on SZSE.
Compute Technologies
- Semiconductor Packaging
- OSAT
What Tianshui Huatian Technology works on
Custom Silicon
Custom silicon means a company designs its own chips for its own products or data centers instead of buying standard parts. The chip is made by a foundry such as TSMC, but the design belongs to the customer.
Interconnect & Networking
Interconnect is the set of links that move data between chips, between boards and between racks. It includes wires on a package, cables inside a server, and the network switches and optical fibre across a data center. A processor is only as useful as the speed at which it can get data in and out.
Follow the share price on the stocks page (002185.SZ).
Also in China
JCET Group, SemiDrive, Accelink Technologies, T-Head (Alibaba), Sunway
