About Chipletz
Chipletz makes the Smart Substrate, a package base that lets chips from different suppliers be combined in one package. A substrate is the layer a chip package is built on, and the company says its design removes the need for an interposer, the silicon layer normally used to wire separate dies together. It targets AI and high-performance computing systems, where large processors are increasingly assembled from several smaller chiplets. Chipletz lists its address in Bee Cave, Texas, in the Austin area.
Chipletz was founded in 2021 and is based in Austin, TX, United States. It is listed under ASICs, Interconnect & Networking. Reported funding is Series B (SKC Ltd).
Compute Technologies
- ASICs
What Chipletz works on
ASICs
An ASIC, or application-specific integrated circuit, is a chip designed to do one job or a narrow set of jobs. Its circuits are fixed when the chip is made. A CPU can run any program; an ASIC does what it was designed for and nothing else.
Interconnect & Networking
Interconnect is the set of links that move data between chips, between boards and between racks. It includes wires on a package, cables inside a server, and the network switches and optical fibre across a data center. A processor is only as useful as the speed at which it can get data in and out.
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