About DISCO Corporation
DISCO makes precision machines that cut, grind and polish semiconductor wafers. Its dicing saws slice a finished wafer into individual chips, and its grinders thin wafers, which is needed for stacked memory and advanced packaging. It also sells the diamond blades and consumables these tools use, and laser-based cutting systems. It does not make chips or lithography tools. DISCO was founded in 1937 in Kure, Hiroshima, as Dai-Ichi Seitosho and took the DISCO name in 1977. It is headquartered in Tokyo and listed on the Tokyo Stock Exchange.
DISCO Corporation was founded in 1937 and is based in Ota, Tokyo, Japan. It is listed under Custom Silicon. Its shares trade as 6146.T on TSE.
Compute Technologies
- Semiconductor Equipment
What DISCO Corporation works on
Custom Silicon
Custom silicon means a company designs its own chips for its own products or data centers instead of buying standard parts. The chip is made by a foundry such as TSMC, but the design belongs to the customer.
Follow the share price on the stocks page (6146.T).
Also in Japan
TDK Electronics, Rapidus, Nikon Precision, Lasertec, Murata Manufacturing
